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this is information on a product in full production. october 2012 doc id 023438 rev 1 1/12 12 EMIF08-1005T16 8 lines ipad? low capacitance emi filter and esd protection in thin micro qfn datasheet ? production data features high efficiency in emi filtering esd performances: up to 15 kv micro qfn 400 m pitch low pcb space consuming with narrow package (1.35 mm width) thin package: 0.5 mm max. ecopack ? 2 compliant component benefits high reduction of parasitic elements through integration improved application robustness against esd high reliability offered by monolithic integration low profile and small packaging save space on the pcb complies with the following standards iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications where emi filtering in es d sensitive equipment is required: mobile phone netbook, laptop pc portable devices figure 1. basic cell configuration description the EMIF08-1005T16 is an 8 lines highly integrated device designed to suppress emi / rfi noise in all systems exposed to electromagnetic interference. this filter includes an esd protection circuitry, which prevents damage to the application when subjected to esd surges up to 15 kv on the input or output pins. tm : ipad is a trademark of stmicroelectronics. micro qfn 16l 1.35 x 3.3 x 0.5 mm input output 100 typical line capacitance = 45 pf at 0 v www.st.com
characteristics EMIF08-1005T16 2/12 doc id 023438 rev 1 1 characteristics figure 2. pin numbering table 1. absolute maximum ratings (limiting values) symbol parameter value unit v pp esd discharge iec 61000-4-2, all pins to gnd: contact discharge air discharge 15 30 kv i rms maximum rms current 50 ma t op operating temperature -40 to 85 c t j maximum junction temperature 125 c t stg storage temperature range -55 to 150 c 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 input 1 input 2 input 3 input 4 input 5 input 6 input 7 input 8 output 1 output 2 output 3 output 4 output 5 output 6 output 7 output 8
EMIF08-1005T16 characteristics doc id 023438 rev 1 3/12 figure 3. electrical characteristics (definitions) table 2. electrical characteristics (values, t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 8 10 v i rm v rm = 3 v per line 100 na r i/o tolerance 10% 90 100 110 c line v line = 0 v dc, f = 1 mhz, v osc = 30 mv 45 50 pf v line = 2.5 v dc, f = 1 mhz, v osc = 30 mv 9 symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = breakdown current br rm rm rm r = input capacitance per line c line v i rm i r v rm v br
characteristics EMIF08-1005T16 4/12 doc id 023438 rev 1 figure 4. s21 attenuation measurements figure 5. analog crosstalk measurements 100.0k 1.0m 10.0m 100.0m 1.0g -50.00 -45.00 -40.00 -35.00 -30.00 -25.00 -20.00 -15.00 -10.00 -5.00 0.00 i1-o1 i2-o2 i3-o3 i4-o4 i5-o5 i6-o6 i7-o7 i8-o8 s21 (db) f (hz) 100.0k 1.0m 10.0m 100.0m 1.0g -120.00 -110.00 -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 i1-o2 i1-o4 i1-o8 xtalk (db) f (hz) figure 6. esd response to iec 61000-4-2 (+15 kv contact discharge) figure 7. esd response to iec 61000-4-2 (-15 kv contact discharge) 18.4 v 6.6 v 3.6 v 3.8 v 1 2 4 3 20 ns / div 5 v / div v clamping v :clamping voltage @ 100 ns cl cl : peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns cl cl 1 2 3 4 -1.9 v 4 -1.1 v 3 -3.5 v 2 -12.0 v 1 5 v / div 20 ns / div v clamping v :clamping voltage @ 100 ns cl cl : peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns cl cl 1 2 3 4 figure 8. line capacitance versus applied voltage figure 9. typical digital crosstalk 0.00 5.00 10.00 15.00 20.00 25.00 30.00 35.00 40.00 45.00 50.00 012345 c line (pf) v line (v) f = 1 mhz v = 30 mv t = 25 c osc j 1 v / div v in = 3 v t r = t f = 2ns 10 ns / div
EMIF08-1005T16 ordering information scheme doc id 023438 rev 1 5/12 2 ordering information scheme figure 10. ordering information scheme emif yy - xxx z tx emi filter number of lines information package xxx = resistance value (ohms) z = capacitance value / 10 (pf) t = thin qfn 16 = number of leads
package information EMIF08-1005T16 6/12 doc id 023438 rev 1 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 3. thin qfn 3.3x1.35 16l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.41 0.45 0.50 0.016 0.018 0.020 a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d 3.25 3.30 3.35 0.128 0.130 0.132 d2 2.85 3.00 3.10 0.112 0.118 0.122 e 1.30 1.35 1.40 0.051 0.053 0.055 e2 0.25 0.40 0.50 0.010 0.016 0.020 e - 0.40 - - 0.016 - k 0.20 - - 0.008 - - l 0.20 0.25 0.30 0.008 0.010 0.012 figure 11. footprint figure 12. marking b 8 e e2 l k 1 9 16 d2 d e a1 a side view bottom view pin#1 id 3.0 0.225 0.4 0.45 0.2 0.4 xx ww y p dot : pin 1 xx : marking ww : assembly week y : assembly year p : assembly plant
EMIF08-1005T16 package information doc id 023438 rev 1 7/12 figure 13. tape and reel specification note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. xx ww yp xx ww yp xx ww yp xx ww yp xx ww yp xx ww yp 4.0 0.1 2.0 0.1 1.55 0.1 4.0 0.1 1.75 0.1 0.70 0.1 user direction of unreeling all dimension in mm 5.5 0.1 12.0 0.3 3.5 0.1 1.50 0.1
recommendations on pcb assembly EMIF08-1005T16 8/12 doc id 023438 rev 1 4 recommendations on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 14. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for central exposed pad: opening to footprint ratio is 50%. c) stencil opening for leads: opening to footprint ratio is 90%. figure 15. recommended stencil window position l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 10 m 190 m 200 m 5 m stencil window footprint 3.0 0.4 0.225 0.4 0.45 0.2 60 m 280 m 212 m 300 m 44 m 400 m 450 m 430 m
EMIF08-1005T16 recommendations on pcb assembly doc id 023438 rev 1 9/12 4.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: powder particle size 20-45 m. 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
recommendations on pcb assembly EMIF08-1005T16 10/12 doc id 023438 rev 1 4.5 reflow profile figure 16. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
EMIF08-1005T16 ordering information doc id 023438 rev 1 11/12 5 ordering information 6 revision history table 4. ordering information order code marking package weight base qty delivery mode EMIF08-1005T16 la (1) 1. the marking can be rotated by 90 to differentiate assembly location qfn 6.29 mg 3000 tape and reel table 5. document revision history date revision changes 31-oct-2012 1 initial release.
EMIF08-1005T16 12/12 doc id 023438 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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